Peripheral adhesive is characterized by low thermal expansion coefficient, high Tg and good heat resistance, and mainly used for peripheral assembly.
The encapsulant is characterized by low thermal expansion coefficient, easy operation, high hardness, good wear resistance and good temperature resistance, and is used for tail fiber potting.
Tail fiber sealing: For passive device sealing and bonding and different customer process sealing, we provide a variety of solutions for customers to choose. While providing the basic model of tough sealing, we upgraded heat curing, UV curing and other product lines that can achieve fast curing, providing the device sealing strip with strong and durable high impact, excellent high and low temperature resistance, and aging resistance.
Lens bonding and sealing: For the new generation of lens materials such as PEI, we provide a UV dual-curing product line for positioning and sealing bonding.
