There are two types of gap fillers: silicon-based and non-silicon. They are typically two-component, room temperature curing, with certain impact resistance and stress relief properties, which are used to fill gaps in electronic components. These materials are used in conjunction with heat sinks or metal housings to help facilitate heat dissipation from critical electronic components. These non-adhering cured adhesives form a soft interface that absorbs stress, fill uneven areas, and improve cooling for high-throughput assembly applications. After being fully cured, they have excellent thermal conductivity, anti-corrosion, insulation and other properties, and are mainly used for thermal conductivity of electronic devices and automotive power batteries.
Thermal Conductivity Adhesive (TCA)
Thermal Conductivity Adhesive (TCA) is a kind of adhesive that takes into account both thermal conductivity and high-strength bonding. It is usually based on two-component polyurethane and epoxy resin, and can be quickly cured at room temperature. The thermal conductivity and bonding properties of TCA can be effectively adjusted through the pretreatment of resins and fillers, as well as the optimization of the curing agent system. After mixing the two components, this type of product gradually forms a bonding layer with good mechanical properties at room temperature. After complete curing, TCA has excellent bonding, anti-corrosion, insulation and other properties. It is mainly used for thermal bonding of automotive power batteries, and has good adhesion to PET, PA, aluminum and other substrates.
Thermal Potting
Thermal Potting is a kind of adhesive with low viscosity, high fluidity, which can be cured at room temperature or cured rapidly under heating. It has no solvent or curing by-products during curing, and can be used for thermal sealing and protection of electronic components. After curing, it has excellent electrical insulation properties, which can withstand environmental pollution, and avoid damage to electronic products caused by environmental factors such as stress, vibration and humidity, especially suitable for products that require good heat dissipation for potting materials. Due to its excellent thermal conductivity, anti-corrosion, insulation and other properties, this type of product can be used for thermal potting of electric motors and electronic components.
Structural Adhesive & Sealant
Structural Adhesive is used for structural bonding, replacing traditional mechanical locking products, mainly including polyurethane and pressure-sensitive hot melt adhesives. Polyurethane Structural Adhesive is a two-component adhesive with moderate viscosity, which can be cured rapidly at room temperature. After being fully cured, this type of product has good toughness, and has good adhesion, anti-corrosion, insulation and other properties in different environments. It is mainly used in the bonding of automotive power battery packs and battery modules, and has good adhesion to plastic, aluminum, electrophoretic steel and other substrates. Pressure-sensitive hot melt adhesive is semi-dry solid that are coated on a substrate when heated to a molten state and have permanent tack after cooling. This type of product has good peel strength and can provide good adhesion under high temperature conditions. Compared with ordinary hot melt pressure-sensitive adhesive, it can provide moderate thermal stability. It is mainly used in the bonding of power battery pouch cell battery modules, and has good adhesion to plastic, aluminum and other substrates.
